发明名称 ADHESIVE MATERIAL COMPOSITION AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND METHOD FOR CONNECTING CIRCUIT TERMINAL
摘要 PROBLEM TO BE SOLVED: To provide an adhesive material composition excellent in low-temperature quick curability, storage stability and adhesive force, and to provide a circuit terminal connected structure, and to provide a method for connecting circuit terminals. SOLUTION: The adhesive material composition comprises (A) an epoxy resin, (B) a thiol compound having in the molecule one or more ester linkages and (C) a photo base generator that generates a base by light irradiation. The circuit terminal connected structure is such that a first circuit member having a first connective terminal and a second circuit member having a second connective terminal are arranged with the first connective terminal and the second connective terminal standing against each other, the above adhesive material composition is interposed in between the first connective terminal and the second connective terminal, and only the first connective terminal and the second connective terminal are electrically connected with each other. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007077382(A) 申请公布日期 2007.03.29
申请号 JP20050302939 申请日期 2005.10.18
申请人 HITACHI CHEM CO LTD 发明人 KATOGI SHIGEKI;KAWAKAMI SUSUMU;SHIRASAKA TOSHIAKI;TOMIZAWA KEIKO
分类号 C09J163/00;C08G59/40;C09J5/06;C09J9/02;C09J11/04;C09J11/06;C09J129/14;C09J133/00;C09J167/00;C09J171/10;C09J175/04;H01B1/22;H01B3/40;H05K3/32;H05K3/36 主分类号 C09J163/00
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