| 摘要 |
An electronic device test apparatus for testing IC chips (IC) by pushing their input/output terminals (HB) against contact units of a test head, provided with an IC moving system ( 410 ) for picking up and moving an IC chip (IC) at the front surface where input/output terminals (HB) are led out, a first camera for capturing an image of the front surface of an IC chip (IC) before being picked up, a second camera for capturing an image of aback surface of an IC chip (IC) after being picked up, and an image processing system for calculating the position of input/output terminals (HB) of an IC chip (IC) picked up by the IC moving system ( 410 ) from the image information captured by the first camera and second camera and identifying the relative position of the IC chip (IC) picked up by the IC moving system ( 410 ) with respect to a contact unit based on the results of calculation, wherein the IC moving system ( 410 ) corrects the position of the IC chip based on the relative position of the input/output terminals (HB) of the IC chip (IC) with respect to the contact unit identified by the image processing system.
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