| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the absorption of green-ultraviolet emitted light by an Au wire or a Cu wire employed for the wire bonding of a semiconductor light emitting device and the reduction of a light emitting output and as the deterioration of light emitting efficiency caused by absorption. <P>SOLUTION: The Au wire or the Cu wire is employed which is obtained by applying the coating of a substance for increasing a reflection factor on the Au wire or Cu wire for the wire bonding of the semiconductor light emitting device. A metal containing at least one kind of Ag, Al, Rh or one kind of these substances is employed preferably as the coating substance. <P>COPYRIGHT: (C)2007,JPO&INPIT |
