CONNECTION SUBSTRATE, MULTI-LAYER WIRING BOARD USING CONNECTION SUBSTRATE, SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING THEM

摘要

PROBLEM TO BE SOLVED: To provide a connection substrate consisting of an insulating resin composition layer made of one or two or more layers, and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where at least a conductor circuit is connected, a multi-layer wiring board using the connection substrate, and a substrate for a semiconductor package, the semiconductor package, and methods for manufacturing them.

SOLUTION: The manufacturing method of the connection substrate comprises a process which forms the connection conductor by removing selectively a first metal layer in a compound metal layer consisting of at least a second metal layer as a carrier and the first metal layer having a different removal condition compared with the second metal layer, a process which forms one or two or more insulation resin composition layers covering at least the side face of the connection conductor, and a process which polishes the insulation resin composition layer so as to expose the connection conductor.

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