| 摘要 |
PROBLEM TO BE SOLVED: To reduce total thermal resistance in a stacking direction without reducing joining reliability between constituents. SOLUTION: An insulated circuit board is provided with an insulated plate 11, a circuit board 12 joined to one surface of the insulated plate 11 and a metal plate 13 joined to the other surface of the insulated plate 11. This insulated circuit board has a configuration in which a semiconductor chip 30 is joined to the surface of the circuit board 12 and the cooling sink section 31 is joined to the lower surface of the metal plate 13 which is opposite to surface joined to the insulated plate 11. The circuit board 12 and the metal plate 13 are formed of pure Al or Al alloy, and the thickness (a) of the circuit board 12 is 0.2-0.8 mm, and the thickness (b) of the metal plate 13 is 0.6-1.5 mm, where a/b≤1. COPYRIGHT: (C)2007,JPO&INPIT |
