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发明名称
Contacts to microdevices
摘要
Provided are microdevices, e.g. integrated circuits, with contact bumps and processes for making the same. The microdevices may have contact bumps on two or more sides of the microdevices. Also provided are stacks of microdevices.
申请公布号
US2007070311(A1)
申请公布日期
2007.03.29
申请号
US20050233367
申请日期
2005.09.23
申请人
ASML NETHERLANDS B.V.
发明人
BIJNEN FRANCISCUS GODEFRIDUS C.;WEENINK WILLEM D.
分类号
G03B27/42;G03B27/52
主分类号
G03B27/42
代理机构
代理人
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