| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an excellent polishing pad preventing an extreme increase of the number of scratches by the pad by making the number of generated scratches between the pads substantially constant, in the polishing pad to be used for forming a flat surface in glass, a semiconductor, a dielectric/metallic composite body and an integrated circuit, etc., and a polishing device. <P>SOLUTION: This polishing pad has a polishing layer of a structure dispersing micro-balloons in a high polymer base material. The polishing layer contains a hydrocarbon-based compound or a fatty acid compound, and the molecular weight is 130 to 2,000. <P>COPYRIGHT: (C)2007,JPO&INPIT |
