| 摘要 |
PROBLEM TO BE SOLVED: To improve the electrical reliability of electronic equipment having an electronic component mounted on a substrate by soldering. SOLUTION: In order to achieve the object, the electronic equipment is provided with a case 10, the substrate 8 provided in the case 10 and the electronic component 7 mounted on the substrate 8. The substrate 8 is provided with a solder 9A and another solder 9B, while the electronic component 7 is provided with a terminal 7A coping with the solder 9A and another terminal 7B coping with the solder 9B. A sectional area in a plane parallel to the substrate 8 at the terminal 7A is reduced toward the substrate 8 from the lower surface of electronic component 7, while the sectional area in a plane parallel to the substrate 8 at the terminal 7B is reduced toward the substrate 8 from the lower surface of the electronic component 7. COPYRIGHT: (C)2007,JPO&INPIT
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