发明名称 |
COVER ASSEMBLY FOR VACUUM ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a cover assembly for a vacuum electronic device enclosure. SOLUTION: The cover assembly for a vacuum electronic device (VED) enclosure comprises (a) a first compartment forming a part of the enclosure of the VED and having a first air passage for allowing the inside of the enclosure of the VED to communicate with a first open air coupling portion, (b) a second compartment surrounding a high voltage circuit for the VED, wherein te second compartment has a second air passage for allowing the inside of the second compartment to communicate with the second open air coupling portion, and (c) EMI bent panel. The first compartment is separated from the second compartment by a partition. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007080838(A) |
申请公布日期 |
2007.03.29 |
申请号 |
JP20060303242 |
申请日期 |
2006.11.08 |
申请人 |
COMMUNICATION & POWER INDUSTRIES |
发明人 |
TOY WILSON W;YATES CHRISTOPHER;KRZEMINSKI PAUL;DAVIES EDMUND T;TORNOE ROBERT N |
分类号 |
H01J23/14;E05D15/40;H01J23/12;H01J23/40;H03F3/54 |
主分类号 |
H01J23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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