发明名称 SUBSTRATE HAVING METALLIC FILM AND ITS MANUFACTURING METHOD, AND ELECTRONIC COMPONENT USING THE SUBSTRATE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate having a metallic film capable of enhancing adhesivity between the substrate and the metallic film, and its manufacturing method. SOLUTION: A unimolecular film 2 is deposited between a substrate 1 and a metallic film 5. The single molecule film 2 is firmly bonded with the substrate 1 via a siloxane bonding. Since the pyrrolyl group having strong affinity to a metal is bonded with the metallic film 5, the adhesiveness between the substrate 1 and the metallic film 5 becomes more excellent. In the present embodiment, the surface of the substrate 1 is not lugged, the metallic film 5 worked in, for example, a wiring pattern is subjected to microfabrication in a desired shape with high accuracy. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007077429(A) 申请公布日期 2007.03.29
申请号 JP20050264705 申请日期 2005.09.13
申请人 ALPS ELECTRIC CO LTD 发明人 MIYAZAWA SATOSHI;OGAWA KAZUFUMI
分类号 C23C18/18;B05D1/18;B05D3/10;B05D7/24;C23C18/31 主分类号 C23C18/18
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