发明名称 ENERGY RAY CURABLE RESIN COMPOSITION AND ADHESIVE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an energy ray curable resin composition having similarly high adhesive strengths to a variety of adherends, e.g., various plastic materials and likes typified by crystalline engineering plastics and transparent engineering plastics, good in heat resistance and moisture resistance, excellent in stiffness, and particularly low in cure shrinkage and little in adhesion strain. SOLUTION: The energy ray curable resin composition contains (A) a (meth)acrylate that has one or more (meth)acryloyl groups in the terminals or side chains of the molecule, that is one or more selected from the group consisting of polybutadienes, polyisoprenes and hydrogen addition products of the above two, and that has a mol. wt. of 500-5,000, (B) a mono-functional (meth)acrylate having a 2-7C saturated hydrocarbon through an ester group, (C) a hydroxyl group-containing (meth)acrylate, (D) a polyfunctional (meth)acrylate, (E) a photopolymerization initiator, and (F) an antioxidant. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007077321(A) 申请公布日期 2007.03.29
申请号 JP20050268503 申请日期 2005.09.15
申请人 DENKI KAGAKU KOGYO KK 发明人 WATANABE ATSUSHI;YODA KIMIHIKO;OSHIMA KAZUHIRO
分类号 C08F290/04;C08F2/44;C09J4/06;C09J11/04;C09J11/06;C09J133/00 主分类号 C08F290/04
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