PACKAGE HAVING INTEGRAL LENS AND WAFER-SCALE FABRICATION METHOD THEREFOR

摘要

A covered chip (10 ) having an optical element (14) integrated in the cover (12) is provided which includes a chip (11) having a front surface (18), an optically active circuit area (16), and bond pads (20) disposed at the front surface. The chip is covered by an at least partially optically translucent or transparent unitary cover (12) that is mounted to the front surface of the chip, and has at least one optical element (14) integrated in the unitary cover. The cover (12) is aligned with the optically active circuit area (16) and vertically spaced from the optically active circuit area.