发明名称 MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To positively solve a defect generated around wiring conductors in a multilayer ceramic substrate having the wiring conductors. <P>SOLUTION: The multilayer ceramic substrate has a plurality of glass ceramic layers 2a-2d laminated thereon and the wiring conductors (via hole conductor 3 and surface conductor 4). The wiring conductors each contain Ag, and the Ag is not diffused in the glass ceramic layers 2a-2d. In order to fabricate such a multilayer ceramic substrate, a binder contained in a glass ceramic green sheet is eliminated in an atmosphere containing oxygen, and then, calcination is executed. In the calcination, non-oxidized atmosphere (e.g. nitride atmosphere) is made before the temperature reaches a softening point of the glass component contained in the glass ceramic green sheet. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007081324(A) 申请公布日期 2007.03.29
申请号 JP20050270697 申请日期 2005.09.16
申请人 TDK CORP 发明人 NAKAMURA TOMOKO;IGARASHI KATSUHIKO
分类号 H05K3/46;C04B35/00;C04B35/622 主分类号 H05K3/46
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