| 摘要 |
PROBLEM TO BE SOLVED: To reduce total thermal resistance in a stacking direction without reducing joining reliability between constituents. SOLUTION: An insulated circuit board 10a with a cooling sink section is provided with an insulated circuit board 20 provided with an insulated plate 11, a circuit board 12 joined to one surface of the insulated plate 11 and a metal plate 13 joined to the other surface of the insulated plate 11; and a cooling sink section 31 provided on the lower surface of the metal plate 13 which is opposite to the surface joined to the insulated plate 11. The circuit board 10a has a configuration in which a semiconductor chip 30 is joined to the surface of the circuit board 12 via a first solder layer 14, and the metal plate 13 is joined to the cooling sink section 31 by a second solder layer 15 containing Sn having Young's modulus of 35 GPa or more, 0.2% proof stress of 30 MPa or more and tensile strength of 40 MPa or more as a main component. COPYRIGHT: (C)2007,JPO&INPIT |
