| 摘要 |
PROBLEM TO BE SOLVED: To improve the electrical reliability of an electronic instrument having an electronic component mounted on a substrate through soldering. SOLUTION: In order to achieve the purpose, the electronic instrument is provided with cases 10A, 10B, a substrate 3 provided inside the cases 10A, 10B, and the electronic component 7 mounted on the substrate 3. The substrate 3 is provided with solders 2A, 2B on upper surface thereof, and the electronic component 7 is provided with a terminal 8 corresponding to the solder 2A and a terminal 9 corresponding to the solder 2B, while the terminal 8 is provided with a stage 8A on the lowermost part thereof and a stage 8C above the stage 8A. The terminal 9 is provided with a stage 9A at the lowermost part thereof, and a stage 9C above the stage 9A. The stage 8A is smaller than the stage 8C in a direction substantially parallel to the lower surface of the electronic component 7, while the stage 9A is smaller than the stage 9C in a direction substantially parallel to the lower surface of the electronic component 7. COPYRIGHT: (C)2007,JPO&INPIT
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