发明名称 |
THERMOCONDUCTIVE RESIN COMPOSITION, ITS STRUCTURE AND ITS USE |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermoconductive resin composition exhibiting excellent heat resistance and thermoconductivity that can be used as a heater base for inkjet printers or as a base material for semiconductor laser pickups for next-generation DVD drives. SOLUTION: The thermoconductive resin composition comprises a polyether sulfone and graphite fine powders. Preferably, the graphite fine powders have an average particle size (D50) of 1-300μm. Preferably, the content of the graphite fine powders is at least 60 mass% based on the total amount of the polyether sulfone and graphite fine powders. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007077299(A) |
申请公布日期 |
2007.03.29 |
申请号 |
JP20050267834 |
申请日期 |
2005.09.15 |
申请人 |
SHOWA DENKO KK |
发明人 |
ARAI TOSHIHIRO;YAMAKI TAKANOBU;NAGAO TAKESHI |
分类号 |
C08L81/06;B41J2/05;C08K3/04;G11B33/12;H01L23/373 |
主分类号 |
C08L81/06 |
代理机构 |
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