发明名称 THERMOCONDUCTIVE RESIN COMPOSITION, ITS STRUCTURE AND ITS USE
摘要 PROBLEM TO BE SOLVED: To provide a thermoconductive resin composition exhibiting excellent heat resistance and thermoconductivity that can be used as a heater base for inkjet printers or as a base material for semiconductor laser pickups for next-generation DVD drives. SOLUTION: The thermoconductive resin composition comprises a polyether sulfone and graphite fine powders. Preferably, the graphite fine powders have an average particle size (D50) of 1-300μm. Preferably, the content of the graphite fine powders is at least 60 mass% based on the total amount of the polyether sulfone and graphite fine powders. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007077299(A) 申请公布日期 2007.03.29
申请号 JP20050267834 申请日期 2005.09.15
申请人 SHOWA DENKO KK 发明人 ARAI TOSHIHIRO;YAMAKI TAKANOBU;NAGAO TAKESHI
分类号 C08L81/06;B41J2/05;C08K3/04;G11B33/12;H01L23/373 主分类号 C08L81/06
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