发明名称 FILM-FORMING COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a composition for forming an insulation film good in such film characteristics as a dielectric constant, mechanical strength, etc. , being applied to an electronic device and the like; and to provide further an insulation film obtained by using the composition and an electronic device comprising the film. SOLUTION: The film-forming composition contains a compound composed of an alicyclic hydrocarbon structure and atoms selected from carbon, hydrogen, oxygen, nitrogen and halogen atoms. The above-mentioned compound has the shape of a particle with a particle diameter of 2-15 nm. The insulation film obtained by using the composition and the electronic device comprising the film are also provided. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007077289(A) 申请公布日期 2007.03.29
申请号 JP20050267406 申请日期 2005.09.14
申请人 FUJIFILM CORP 发明人 ADEGAWA YUTAKA
分类号 C09D165/00;C09D5/25;C09D147/00;C09D149/00;H01L21/312;H01L21/768;H01L23/522 主分类号 C09D165/00
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