| 摘要 |
PROBLEM TO BE SOLVED: To provide a die polishing device and its method which shorten the time required for polishing a die. SOLUTION: The die polishing device 1 is equipped with a die mold information acquisition means 63 which acquires the information regarding the die D from an IC chip 81 provided on the die mold D, and constituted so as to grind the die D in an appropriate condition, based on the information acquired by the die information acquisition means 63. COPYRIGHT: (C)2007,JPO&INPIT
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