Method of manufacturing high density printed circuit boad

摘要

Disclosed is a method of manufacturing a high density printed circuit board, in which a copper clad laminate is not used as a basic material, thus enabling the manufacture of a thin printed circuit board and solving the problems occurring in conventional methods of manufacturing a printed circuit board. The method of manufacturing the printed circuit board according to this invention includes forming a circuit pattern to a predetermined depth in one surface of a copper substrate; placing an insulating layer on the surface of the substrate having the circuit pattern; and etching the substrate, thus exposing the circuit pattern.