PRODUCTION METHOD FOR COMPONENT BUILT-IN MODULE AND COMPONENT BUILT-IN MODULE

摘要

[PROBLEMS] A production method for a component built-in module and a component built-in module being capable of constantly mounting circuit components on specified mounting positions and being high in reliability. [MEANS OF SOLVING PROBLEMS] A plurality of component mounting lands (3) are independently formed in a insular shape on a transfer sheet (20), and circuit components (4a, 4b) are connected to the component mounting lands (3). An insulating resin layer (1a) is formed on the transfer sheet so as to cover the circuit components, this resin layer is cured, and the circuit components and the component mounting land (3) are buried in the resin layer (1a). Then, the transfer sheet is separated from the resin layer (1a), and a wiring pattern (2) for connecting lands or connecting lands with other components is formed on the rear surface of the component mounting land (3)-exposed resin layer.