SOLDER LAYER, HEAT SINK USING SUCH SOLDER LAYER AND METHOD FOR MANUFACTURING SUCH HEAT SINK

摘要

A heat sink (10) is provided with a substrate (1), an electrode layer (2) formed on the substrate (1), and a solder layer (3) formed on the substrate (1). The solder layer (3) has a bonding strength of 30MPa or more and a shear strain of 0.07 or more. The heat sink may be a submount, and may be provided with the submount substrate (1), the electrode layer (2) formed on the substrate, and the solder layer (3), and the solder layer (3) may be embedded in a window section (2A) of the electrode layer, and an outer circumference section of the solder layer (3) may be connected with the electrode layer (2). The solder layer (3) can be bonded with the semiconductor device at a high bonding strength, and the low cost submount is provided.