发明名称 BURIED WELL FOR SEMICONDUCTOR DEVICE BY FORMING SURFACE WELL ON SUBSTRATE AND THEN FORMING EPITAXIAL LAYER THEREON
摘要 <p>A substrate having a buried well is provided. The substrate may be formed by implanting ions in a surface well of a first substrate and subsequently forming a semiconductor layer, such as an epitaxial layer, over the surface well. In this manner, the surface well becomes a buried well having a semiconductor layer that is substantially undoped formed thereon. In an embodiment, a transistor is formed on the substrate. Because the epitaxial layer is substantially undoped, the transistor may be formed such that the junction capacitance between the source/drain regions and the underlying region is reduced. If desired, the epitaxial layer, or a portion thereof, may be doped to decrease the resistance between the channel region and the well contact.</p>
申请公布号 KR20070034934(A) 申请公布日期 2007.03.29
申请号 KR20060090134 申请日期 2006.09.18
申请人 发明人
分类号 H01L21/336;H01L29/78 主分类号 H01L21/336
代理机构 代理人
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