发明名称 |
HIGH THERMAL CONDUCTIVITY MATERIALS ALIGNED WITHIN RESINS |
摘要 |
In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the fillers have an aspect ratio of between 3-100. The fillers are substantially evenly distributed through the host resin matrix, and are aligned in essentially the same direction. In some embodiments the resins are highly structured resin types |
申请公布号 |
EP1766636(A2) |
申请公布日期 |
2007.03.28 |
申请号 |
EP20050790212 |
申请日期 |
2005.06.15 |
申请人 |
SIEMENS POWER GENERATION, INC. |
发明人 |
SMITH, JAMES DAVID;STEPHENS, GARY;WOOD, JOHN WILLIAM |
分类号 |
C08K3/28;C08K3/22;H01B3/00 |
主分类号 |
C08K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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