| 摘要 |
A semiconductor device and a PCB(Printed Circuit Board) are provided to prevent the degradation of bonding between a solder ball or a solder bump and a predetermined lower layer by using a locking structure capable of improving solder joint reliability. A semiconductor device includes a semiconductor chip with a bond pad exposed to the outside through a passivation layer, a rerouting pattern(108) connected with the bond pad on the passivation, a second interlayer dielectric, a solder ball pad, and a first locking structure. The second interlayer dielectric is formed on the rerouting pattern. The solder ball pad(118) is a portion of the rerouting pattern. The first locking structure(110) is formed at an edge portion of the solder ball pad by using the difference of etching between different metals. |
