发明名称 Substrate having embedded passive devices and Manufacturing method thereof
摘要 A substrate having an embedded passive element and its manufacturing method are provided to restrain the warpage of the substrate itself and to prevent the influence of a warped substrate on the passive element. A metal line pattern is formed under a passive element(240) corresponding to an electrode structure of the passive element. The passive element is molded by using a molding material(250). The molded passive element is mounted in a cavity of a substrate. The passive element is one selected from a group consisting of a resistor, an inductor and a condenser. A stack type ceramic condenser is used as the condenser.
申请公布号 KR100700922(B1) 申请公布日期 2007.03.28
申请号 KR20050097644 申请日期 2005.10.17
申请人 发明人
分类号 H01L27/04 主分类号 H01L27/04
代理机构 代理人
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