| 摘要 |
A stack chip and a stack chip package comprising the same are provided to connect internal circuits of two semiconductor chips to each other by using one input/output buffer connected to an external connection terminal. A stack chip includes two semiconductor chips(112,122) which are opposite to each other. Each of the semiconductor chips includes a silicon substrate having an active surface and a rear surface opposite to the active surface, an internal circuit formed on the active surface, chip pads(114,124) having input/output pads connected through input/output buffers to the internal circuits, and connective pads(118,128) having one or more input/output pads formed on the active surface. The connective pads of the two semiconductor chips are connected electrically with each other. At least, one semiconductor chip includes a first through-electrode having an exposed connective terminal. |
