| 摘要 |
A probe card includes a plurality of probe modules (1000), a multi-layer ceramic substrate (2000) provided below the probe module, and a solder ball (183) for connecting the probe module and the multi-layer ceramic substrate, and the height (H) of the solder ball is controlled depending on location of the multi-layer ceramic substrate. Therefore, the probe card and manufacturing method thereof improves the accuracy of the test process by matching the height of the probe of the probe module and the reference planarization line when a planarity of the multi-layer ceramic substrate is bad or is varied during the probe card assembling process. |
