发明名称 Metal-polishing liquid and chemical-mechanical polishing method
摘要 <p>The present invention provides a metal-polishing liquid comprising an oxidizing agent and a heterocyclic aromatic ring compound, wherein the time until the oxidation reaction rate is (E1+E2)/2 is shorter than 1.0 second, E1 being an oxidation reaction rate immediately after initiation of oxidation of a metal surface to be polished and E2 being an oxidation reaction rate when the oxidation reaction has reached a steady state.</p>
申请公布号 EP1767602(A2) 申请公布日期 2007.03.28
申请号 EP20060019195 申请日期 2006.09.13
申请人 FUJIFILM CORPORATION 发明人 SUGIYAMA, SHINICHI
分类号 C09G1/02;B24B37/00;C09K3/14;H01L21/304;H01L21/321 主分类号 C09G1/02
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