发明名称 Fluid ejection head assembly
摘要 <p>A fluid ejection head (12) of a fluid ejection device (10) is provided, the fluid ejection head (12) having a substrate (30), a fluid ejection die (32) coupled with the substrate (30), an electromagnetic radiation-curable adhesive (52) disposed on the substrate (30), and a cover (34) coupled with the substrate (30) via the electromagnetic radiation-curable adhesive (52), wherein the cover (34) includes an opening (42) configured to pass fluids ejected from the fluid ejection die (32), and wherein the cover (30) is made at least partially of a material transparent to electromagnetic radiation.</p>
申请公布号 EP1767366(A2) 申请公布日期 2007.03.28
申请号 EP20060024059 申请日期 2004.07.22
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 WOOD, BENJAMIN H., III;SCHEFFELIN, JOSEPH E.;LASSAR, NOAH;AKHAVAIN, MOHAMMAD
分类号 B41J2/16 主分类号 B41J2/16
代理机构 代理人
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