| 摘要 |
A parameter change method of a wafer laser sawing apparatus and its device are provided to perform smoothly a cutting process by setting automatically a parameter corresponding to thickness of a wafer. A thickness measurement process is performed to measure the thickness of a wafer on a chuck table(S100). A parameter detection process is performed to detect a parameter corresponding to the thickness of the wafer(S200). A parameter identification process is performed to identify the presence of the parameter corresponding to the thickness of the wafer(S300). A setting value decision process is performed to decide a setting value with the corresponding parameter when the corresponding parameter is identified(S400). An error signal is outputted and an error message is displayed when the corresponding parameter is not identified(S500).
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