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发明名称
METHOD OF ETCHING AN INTERLAYER INSULATING LAYER IN A SEMICONDUCTOR DEVICE
摘要
申请公布号
KR100703563(B1)
申请公布日期
2007.03.28
申请号
KR20050131543
申请日期
2005.12.28
申请人
DONGBU ELECTRONICS CO., LTD.
发明人
LEE, KI MIN
分类号
H01L21/306
主分类号
H01L21/306
代理机构
代理人
主权项
地址
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