发明名称 Method for producing an apparatus housing
摘要 <p>A flexible electronic circuit board (2) has electrical components (3) placed on one side while a supporting plate (8) is attached on the other side. The assembly is placed in a molding tool (11, 12) that has a recess (13) into which the components (3) can project and which is sealed by the support plate (8). Plastic material (10) is injected to form the housing while the recess (13) remains clear. Independent claims are also included for (i) a circuit board (2) with electronic components (3) stiffened with a supporting backing plate (8); and (ii) a plastic instrument housing made by this process.</p>
申请公布号 EP1270167(B1) 申请公布日期 2007.03.28
申请号 EP20020009637 申请日期 2002.04.27
申请人 GEBR. SWOBODA GMBH 发明人 HACKL, JOHANNES
分类号 B29C45/14;E05B17/22;E05B81/54;E05B85/02;H05K1/02;H05K1/18;H05K3/00;H05K3/38;H05K5/00;H05K5/06 主分类号 B29C45/14
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