| 摘要 |
The element has a microfrequency plate formed on an intrinsic semiconductor wafer (26), and diodes (20) disposed on front surface of the wafer, where the diodes are independently polarized with respect to each other. The wafer is pierced with metallized holes (25) connected to diode polarization conductors. A control part has amplifiers and control logic and is formed on a doped semiconductor wafer (34). A network of power supply leads, amplifiers, logic and diodes is formed, according to printed circuit technique, on a front surface of the control part or rear surface of the plate. An independent claim is also included for a method of forming an element of a phased array antenna.
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