Interconnect structure with dielectric barrier and fabrication method thereof

摘要

An interconnect structure with dielectric barrier and fabrication thereof. The interconnect structure includes a semiconductor substrate and a plurality of stacked structures formed thereon, each stacked structure including a conductive line and a conductive plug thereon. A conformal dielectric barrier is formed over the surfaces of the stacked structures and a blanket second dielectric layer is formed over the dielectric barrier to form an inter-metal layer.