发明名称 |
Impedance matching commonly and independently |
摘要 |
A semiconductor device is easy for high accuracy impedance matching against differences in impedance of a transmission line and a package wire. A semiconductor chip having external output buffers and a packaging circuit are included. Each external output buffer has a first output portion whose internal impedance is adjusted commonly with other external output buffers in accordance with impedance control data and a second output portion whose internal impedance is adjusted independently of other external output buffers. Both of the first and second output portions are connected in parallel to a common output terminal. Common adjustment by the first output portion can cope with impedance of the transmission line and individual adjustment by the second output portion can cope with a difference of package wires. |
申请公布号 |
US7196540(B2) |
申请公布日期 |
2007.03.27 |
申请号 |
US20040983723 |
申请日期 |
2004.11.09 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
UENO HIROKI |
分类号 |
G11C11/417;H03K19/003;H01L21/822;H01L23/12;H01L27/04;H03K19/00;H03K19/0175;H04L25/02 |
主分类号 |
G11C11/417 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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