发明名称 Semiconductor laser device and method of fabricating the same
摘要 The width of a current pass region of a semiconductor laser device is narrowed as much as possible, thus implementing a stable single transverse mode. The device is relatively resistant against physical impact. The device includes a semiconductor substrate having first and second opposite surfaces, and, in order, a first conductive type clad, active layer, etch stop layer, current blocking layer formed in a V-groove shape so that a part of the etch stop layer is exposed, second conductive type clad formed entirely over the entire of the V-groove and the current blocking layer, optical guide layer, current pass facilitation layer, cap layer, second conductive type electrode, and a first conductive type electrode formed on the second surface of the semiconductor substrate.
申请公布号 US7197057(B2) 申请公布日期 2007.03.27
申请号 US20040896344 申请日期 2004.07.21
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 HWANG SUN-LYEONG
分类号 H01S5/223;H01S5/24;H01S5/00;H01S5/12;H01S5/22;H01S5/323;H01S5/343 主分类号 H01S5/223
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