| 发明名称 |
Negative-type photosensitive resin composition containing epoxy compound |
| 摘要 |
A negative-type photosensitive resin compositions containing an epoxy compound are provided. These compositions use poly(p-vinylphenol) as the base resin and have good development performance when using an aqueous developer, such as tetramethylammonium hydroxide solution.
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| 申请公布号 |
US7195855(B2) |
申请公布日期 |
2007.03.27 |
| 申请号 |
US20040768940 |
申请日期 |
2004.01.30 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
ARAO KEI;NOMURA MAKOTO |
| 分类号 |
G03F7/004;G03F7/032;G03F7/027;G03F7/038 |
主分类号 |
G03F7/004 |
| 代理机构 |
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