| 摘要 |
The invention is a package (100) housing optical components and electronic components in separate enclosures. The first enclosure (142/130/170/175) includes optical components (165/157/180), optical alignment means (160), an d a heat pipe (155) that dissipates heat generated by the optical components therein. The first and second enclosures are hermetically sealed. The second enclosure (130/112/110/114) includes electronic components (120), a Peltier- type cooling device (125), and/or other heat dissipating devices. The first and second enclosures are each hermetically sealed. The first enclosure can be mounted above the second enclosure or vice versa in alternative embodiments of the invention. In another embodiment, a heat sink (105) is also mounted to t he top of the dual-enclosure package. |
