| 发明名称 |
Apparatus and method for treating substrates |
| 摘要 |
The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and more particularly to a polishing apparatus having a workpiece transfer robot for transferring a workpiece from one operation to the next. |
| 申请公布号 |
US7196011(B2) |
申请公布日期 |
2007.03.27 |
| 申请号 |
US20050036865 |
申请日期 |
2005.01.13 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO CHAN-WOO;BOO JAE-PHIL;KIM MYUNG-SEOK;KANG JONG-MUK;KIM IK-JOO;SUNG JUNG-HWAN;JUNG KI-HONG;SEO KEON-SIK |
| 分类号 |
H01L21/469;B24B37/013;B24B37/04;B24B49/03;H01L21/304;H01L21/306 |
主分类号 |
H01L21/469 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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