| 摘要 |
A wire saw ( 1; 100 ) for cutting a workpiece includes a device ( 21, 22, 24, 27 ) for setting, controlling and/or maintaining a predetermined or desired water content in at least part of the gaseous medium that contacts the slurry. With the wire saw according to the invention and the process carried out using this wire saw, it is possible to achieve consistently good surface properties of the resulting wafers over a prolonged period of use of a slurry.
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