| 摘要 |
FIELD: electronic engineering, namely pressurization of electronic elements mounted on board, possible use for protecting elements from effect of environment. ^ SUBSTANCE: location where elements are mounted on board is processed, then gap between mounted element and board is filled with glue with viscosity (15-20).m2/s, then after glue solidifies first layer of special sealant is applied, after polymerization of which applied onto element is a layer of special compound, and then whole board is covered in a layer of protective lacquer. ^ EFFECT: increased reliability of cover, prevented damage to element being protected. |
