发明名称 Heat dissipation assembly and method for producing the same
摘要 A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive grease is incompatible with the electrically insulating and thermally conductive sheet. Heat from the heat generator such as a semiconductor device or the like can be effectively dissipated while an electrically insulating condition is maintained over a long period of time.
申请公布号 US7196413(B2) 申请公布日期 2007.03.27
申请号 US20050069293 申请日期 2005.03.01
申请人 DOW CORNING TORAY CO., LTD. 发明人 SHIBUYA AKIHIRO;FURUKAWA MOTOYUKI;NARUSE MIKIO;EHIRA ATSUSHI;OGAWA KAZUHIRO;OOTA HIROTOSHI;ABE KAZUYOSHI;IKEZAWA ATSUSHI;KAKEHI TORU
分类号 H01L23/10;H05K7/20;C09K5/14;H01L21/48;H01L23/34;H01L23/36;H01L23/373;H01L25/07 主分类号 H01L23/10
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