发明名称 Method of manufacturing a multilayered doped conductor for a contact in an integrated circuit device
摘要 A method of manufacturing a memory device addressing reliability and refresh characteristics through the use of a multilayered doped conductor, and a method making is described. The multilayered doped conductor creates a high dopant concentration in the active area close to the channel region. The rich dopant layer created by the multilayered doped conductor is less susceptible to depletion from trapped charges in the oxide. This improves device reliability at burn-in and lowers junction leakage, thereby providing a longer period between refresh cycles.
申请公布号 US7195995(B2) 申请公布日期 2007.03.27
申请号 US20040989530 申请日期 2004.11.16
申请人 MICRON TECHNOLOGY, INC. 发明人 MOULI CHANDRA V.
分类号 H01L21/425;H01L21/225;H01L21/285;H01L21/4763;H01L21/768;H01L21/8242 主分类号 H01L21/425
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