发明名称 Method for PECVD deposition of selected material films
摘要 A process for PECVD of selected material films on a substrate comprising the steps of placing a substrate in a PECVD chamber and maintaining the chamber under vacuum pressure while introducing a precursor gas, a reactant gas, and an ionization enhancer agent into the chamber. A plasma is generated from the gases within the chamber. The energy generating the plasma causes the formation of charged species. The resulting charged species of the ionization enhancer agent assists in the formation of chemically reactive species of at least the precursor.
申请公布号 US7196020(B2) 申请公布日期 2007.03.27
申请号 US20010825613 申请日期 2001.04.03
申请人 MICRON TECHNOLOGY, INC. 发明人 SHARAN SUJIT;SANDHU GURTEJ S.
分类号 H01L21/469;C23C16/08;H01L21/285 主分类号 H01L21/469
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