| 发明名称 |
Submount and semiconductor device |
| 摘要 |
The present invention provides a submount that allows a semiconductor light-emitting element to be attached with a high bonding strength.
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| 申请公布号 |
US7196356(B2) |
申请公布日期 |
2007.03.27 |
| 申请号 |
US20050520385 |
申请日期 |
2005.01.03 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
ISHII TAKASHI;HIGAKI KENJIRO;TSUZUKI YASUSHI |
| 分类号 |
H01L21/52;H01L31/12;H01L21/60;H01S5/02;H01S5/022 |
主分类号 |
H01L21/52 |
| 代理机构 |
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