发明名称 CUTTING APPARATUS OF AMPULE
摘要 Disclosed is an ampule cutting apparatus including an ampule cutting unit for housing and cutting an ampule head, a object collecting unit (20) for sucking the cut ampule head (H) and minute flakes generated in the ampule cutting operation with the air, and separating the objects from the air, a negative pressure generating device (50) for applying a negative pressure to the object collecting unit; and a collecting unit for collecting the objects sucked by the object collecting unit.
申请公布号 KR100701873(B1) 申请公布日期 2007.03.26
申请号 KR20050071533 申请日期 2005.08.05
申请人 SAMSUNG GWANGJU ELECTRONICS CO., LTD. 发明人 OH, JANG KEUN;SEO, JI WON
分类号 B67B7/46;A61J1/00 主分类号 B67B7/46
代理机构 代理人
主权项
地址