发明名称 |
CUTTING APPARATUS OF AMPULE |
摘要 |
Disclosed is an ampule cutting apparatus including an ampule cutting unit for housing and cutting an ampule head, a object collecting unit (20) for sucking the cut ampule head (H) and minute flakes generated in the ampule cutting operation with the air, and separating the objects from the air, a negative pressure generating device (50) for applying a negative pressure to the object collecting unit; and a collecting unit for collecting the objects sucked by the object collecting unit. |
申请公布号 |
KR100701873(B1) |
申请公布日期 |
2007.03.26 |
申请号 |
KR20050071533 |
申请日期 |
2005.08.05 |
申请人 |
SAMSUNG GWANGJU ELECTRONICS CO., LTD. |
发明人 |
OH, JANG KEUN;SEO, JI WON |
分类号 |
B67B7/46;A61J1/00 |
主分类号 |
B67B7/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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