| 摘要 |
Provided is a method for preparing a conductive particle to improve the binding force between a metal particle and a polymer particle and to prevent the generation of the harmful waste due to plating. The method comprises the steps of preparing a metal particle and a polymer particle(10); binding the metal particle and the polymer particle to form a metal layer, thereby allowing some part of the metal particle to be infiltrated into the surface of the polymer particle; and binding the metal layer and a thermosetting polymer particle to form a separation prevention layer(13). Preferably the metal layer is formed by binding a metal particle and a polymer particle to form a buffer layer(12), and binding the buffer layer metal particle and a conductive metal particle to form a conductive layer(11).
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