| 摘要 |
Objects of the present invention are to provide oxidation resistant nickel-coated copper powder for conductive paste capable of forming a conductive wiring part for an electronic circuit, and to provide a method for producing the same. In order to achieve the objects, there is provided nickel-coated copper powder which is characterized in that it comprises nickel-coated copper particles in which a core material is copper particles, a catalyst for plating is fixed to a surface of the copper particles by reduction reaction and electroless plated nickel is applied to the outermost surface. The reduction reaction is characterized in that hydrazine is used as a reducing agent. |
