| 摘要 |
A semiconductor device manufacturing apparatus is provided to prevent polymers from being deposited on an ESC(ElectroStatic Chuck) cover and to minimize the contamination due to particles by forming a Y2O3 coating on the ESC cover. A semiconductor device manufacturing apparatus includes a chamber, an upper electrode, an ESC, an ESC cover, and a Y2O3 coating. The upper electrode is installed at an inner upper portion of the chamber. The upper electrode is applied with an RF(Radio Frequency) power source. The ESC is installed at an inner lower portion of the chamber in order to support a semiconductor substrate. The ESC cover(212) is installed at a lower peripheral portion of the ESC in order to protect a lower connecting portion of the ESC. The Y2O3 coating(212a) is formed on the ESC cover.
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