| 摘要 |
A thin wafer transfer apparatus is provided to transfer stably a thin wafer regardless of the warpage of the wafer by moving a chuck table itself mounted with the wafer to and fro between a wafer rear surface polishing apparatus and a tape mounting unit using a guide rail. A thin wafer transfer apparatus includes a guide rail and a chuck table. The guide rail(185) is installed between a wafer rear surface polishing apparatus and a tape mounting unit. The chuck table transfers a thin wafer through the guide rail.
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